CHEMICAL-MECHANICAL PLANARIZATION OF ALUMINUM-BASED ALLOYS FOR MULTILEVEL METALLIZATION

被引:2
|
作者
FURY, MA
SCHERBER, DL
STELL, MA
机构
关键词
D O I
10.1557/S0883769400045607
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
[No abstract available]
引用
收藏
页码:61 / 64
页数:4
相关论文
共 50 条
  • [1] CHEMICAL-MECHANICAL POLISHING OF COPPER FOR MULTILEVEL METALLIZATION
    STAVREVA, Z
    ZEIDLER, D
    PLOTNER, M
    DRESCHER, K
    APPLIED SURFACE SCIENCE, 1995, 91 (1-4) : 192 - 196
  • [2] A multilevel approach to the control of a chemical-mechanical planarization process
    Telfeyan, R
    Moyne, J
    Chaudhry, N
    Pugmire, J
    Shellman, S
    Boning, D
    Moyne, W
    Hurwitz, A
    Taylor, J
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 1996, 14 (03): : 1907 - 1913
  • [3] Advances in chemical-mechanical planarization
    Singh, RK
    Bajaj, R
    MRS BULLETIN, 2002, 27 (10) : 743 - 751
  • [4] Advances in Chemical-Mechanical Planarization
    Rajiv K. Singh
    Rajeev Bajaj
    MRS Bulletin, 2002, 27 : 743 - 751
  • [5] INLAID COPPER MULTILEVEL INTERCONNECTIONS USING PLANARIZATION BY CHEMICAL-MECHANICAL POLISHING
    MURARKA, SP
    STEIGERWALD, J
    GUTMANN, RJ
    MRS BULLETIN, 1993, 18 (06) : 46 - 51
  • [6] Chemical boundary lubrication in chemical-mechanical planarization
    Liang, H
    TRIBOLOGY INTERNATIONAL, 2005, 38 (03) : 235 - 242
  • [7] Chemical-mechanical planarization advances with the times
    University of Central Florida, Orlando
    不详
    不详
    IEEE Potentials, 2008, 1 (26-30): : 26 - 30
  • [8] CHAMPS (CHemicAl-Mechanical Planarization Simulator)
    Kim, YH
    Yoo, KJ
    Kim, KH
    Yoon, BY
    Park, YK
    Ha, SR
    Kong, JT
    2000 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES, 2000, : 123 - 126
  • [9] Optimization of the chemical-mechanical planarization process to build multilevel copper interconnection structures
    Murarka, SP
    CHEMICAL MECHANICAL PLANARIZATION I: PROCEEDINGS OF THE FIRST INTERNATIONAL SYMPOSIUM ON CHEMICAL MECHANICAL PLANARIZATION, 1997, 96 (22): : 121 - 136
  • [10] Chemical-mechanical planarization of Cu and Ta
    S. V. Babu
    A. Jindal
    Y. Li
    JOM, 2001, 53 : 50 - 52