LIGHT-ASSISTED DEPOSITION OF SILICON-BASED DIELECTRICS FOR OPTICAL INTERCONNECTION IN OPTOELECTRONICS

被引:0
作者
SAYAH, A
NISSIM, YI
机构
[1] France Telecom/CNET/PAB, Laboratoire de Bagneux, Bagneux, 92225, 196 Avenue H. Ravera
关键词
D O I
10.1016/0022-3093(95)00214-6
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The structural quality of rapid thermal chemical vapour deposited dielectric films have been utilized to fabricate optical waveguides at 1.5 mu m. The guides composed of SiOxNy guiding layer sandwiched between two SiO2 layers. A precise model has been utilized to define the indexes of refraction and thicknesses of the different layers. Special care has been made in the fabrication process to define the entrance and exit facets of the guide. A resulting loss of 1.5 dB/cm has been measured in this structure. This result is among the lowest losses reported on as-deposited dielectric guides.
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页码:473 / 476
页数:4
相关论文
共 12 条
[1]   OPTICAL-PROPERTIES OF SILICON OXYNITRIDE DIELECTRIC WAVE-GUIDES [J].
BOSSI, DE ;
HAMMER, JM ;
SHAW, JM .
APPLIED OPTICS, 1987, 26 (04) :609-611
[2]   STRUCTURAL AND OPTICAL-PROPERTIES OF SILICON OXYNITRIDE ON SILICON PLANAR WAVE-GUIDES [J].
DELGIUDICE, M ;
BRUNO, F ;
CICINELLI, T ;
VALLI, M .
APPLIED OPTICS, 1990, 29 (24) :3489-3496
[3]  
FLICSTEIN J, 1991, Patent No. 9103964
[4]   LOW-PRESSURE CHEMICAL VAPOR-DEPOSITION SILICON-OXYNITRIDE FILMS FOR INTEGRATED-OPTICS [J].
GLEINE, W ;
MULLER, J .
APPLIED OPTICS, 1992, 31 (12) :2036-2040
[5]  
KAPER K, 1991, IEEE PHOTON TECHNOL, V3
[6]   LOW-TEMPERATURE PLASMA CHEMICAL VAPOR-DEPOSITION OF SILICON OXYNITRIDE THIN-FILM WAVEGUIDES [J].
LAM, DKW .
APPLIED OPTICS, 1984, 23 (16) :2744-2746
[7]  
LEBLAND F, 1992, THESIS U PARIS 7
[9]   LOW-PRESSURE PHOTOCHEMICAL VAPOR-DEPOSITION OF SILICON DIOXIDE ON INP SUBSTRATES [J].
NISSIM, YI ;
REGOLINI, JL ;
BENSAHEL, D ;
LICOPPE, C .
ELECTRONICS LETTERS, 1988, 24 (08) :488-489
[10]   SILICON OXYNITRIDE FILMS ON FUSED SILICA FOR OPTICAL WAVEGUIDES [J].
RAND, MJ ;
STANDLEY, RD .
APPLIED OPTICS, 1972, 11 (11) :2482-+