Performance Testing of Micro Loop Heat Pipes

被引:1
作者
Hsu, Chin-Chun [1 ]
Kang, Shung-Wen [1 ]
Hou, Tung-Fu [1 ]
机构
[1] Tamkang Univ, Dept Mech & Electromech Engn, Tamsui 251, Taiwan
来源
JOURNAL OF APPLIED SCIENCE AND ENGINEERING | 2005年 / 8卷 / 02期
关键词
Micro Loop Heat Pipes; Two Phase Flow; Non-condensable Gas; Thermal Resistance;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A 60 mm x 33 mm x 0.8 mm micro loop heat pipe (MLHP), consisting of an evaporator, vapor line, condenser and two liquid lines, was fabricated and characterized. The wicking structure consists of parallel V-grooves with a hydraulic diameter of 47 mu m, 67 mu m and 83 mu m, and is formed by bulk silicon etching. The MLHP was realized by bonding a glass wafer onto a silicon substrate, so as to result in a transparent cover for two-phase flow visualization. Water and methanol were used as the working fluids. The test results showed that water demonstrates a wider heat load performance range (3.3 W similar to 12.96 W) than methanol (1.2 W similar to 5.85 W) for the MLHP with an evaporator area of 1 cm(2) and condenser temperature of 17 C-circle. The best thermal resistance of the MLHP was 0.106 C-circle/W, 64 times higher than that without fluid filling. The smaller diameter grooves caused the higher liquid capillarity and enhanced transfer capacity. It was observed that the presence of non-condensable gas negatively affected the reliability of the MLHP and significantly reduced the performance.
引用
收藏
页码:123 / 132
页数:10
相关论文
共 4 条
  • [1] Fox R. W., 1998, INTRO FLUID MECH, P363
  • [2] Steady state model of a micro loop heat pipe
    Kim, J
    Golliher, E
    [J]. EIGHTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2002, 2002, : 137 - 144
  • [3] Maidanik Y. F., 2000, SOL EN TECHN C TAIP, P50
  • [4] Wolf D. A., 1994, 941575 SAE