ANALYSIS ON YIELD OF INTEGRATED-CIRCUITS AND A NEW EXPRESSION FOR YIELD

被引:36
作者
OKABE, T [1 ]
NAGATA, M [1 ]
SHIMADA, S [1 ]
机构
[1] HITACHI LTD,CENT RES LAB,TOKYO,JAPAN
关键词
D O I
10.1002/eej.4390920619
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:135 / 141
页数:7
相关论文
共 50 条
[21]   EQUIVALENCE PROOFS OF SOME YIELD MODELING METHODS FOR DEFECT-TOLERANT INTEGRATED-CIRCUITS [J].
THIBEAULT, C ;
SAVARIA, Y ;
HOULE, JL .
IEEE TRANSACTIONS ON COMPUTERS, 1995, 44 (05) :724-728
[22]   HIGH-YIELD PROCESS FOR GAAS ENHANCEMENT-MODE MESFET INTEGRATED-CIRCUITS [J].
MUN, J ;
PHILLIPS, JA ;
BARRY, BE .
IEE PROCEEDINGS-I COMMUNICATIONS SPEECH AND VISION, 1981, 128 (04) :144-147
[23]   DEFECT ANALYSIS OF INTEGRATED-CIRCUITS [J].
LUTHER, PK ;
HOLT, DB ;
LESNIAK, M .
INSTITUTE OF PHYSICS CONFERENCE SERIES, 1983, (68) :235-238
[24]   INTEGRATED-CIRCUITS [J].
BURSKY, D .
ELECTRONIC DESIGN, 1983, 31 (20) :172-&
[25]   DETERMINATION OF THE PERCENTAGE YIELD OF SATISFACTORY HYBRID INTEGRATED-CIRCUITS USING A GRAPHICAL-ANALYTICAL METHOD [J].
KRYUKOV, YG ;
SHISHKIN, VM ;
KIRPICHEV, AB .
TELECOMMUNICATIONS AND RADIO ENGINEERING, 1979, 33-4 (02) :128-130
[26]   EFFECT OF EPI DEFECTS ON CIRCUIT CHIP YIELD OF STANDARD BURIED COLLECTOR SILICON INTEGRATED-CIRCUITS [J].
CHO, KH ;
HEMMER, DP .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (08) :C368-C368
[27]   THE FUTURE OF INTEGRATED-CIRCUITS CONSIDERED AT THE INTERNATIONAL-CONFERENCE ABOUT THE NEW TRENDS IN INTEGRATED-CIRCUITS [J].
不详 .
ONDE ELECTRIQUE, 1981, 61 (04) :17-20
[28]   Maximizing Yield for Approximate Integrated Circuits [J].
Traiola, Marcello ;
Virazel, Arnaud ;
Girard, Patrick ;
Barbareschi, Mario ;
Bosio, Alberto .
PROCEEDINGS OF THE 2020 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION (DATE 2020), 2020, :810-815
[29]   MULTIFUNCTION SAG PROCESS FOR HIGH-YIELD, LOW-COST GAAS MICROWAVE INTEGRATED-CIRCUITS [J].
BAHL, IJ ;
DRINKWINE, MJ ;
GEISSBERGER, AE ;
GRIFFIN, EL ;
GRZYB, JA .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1990, 38 (09) :1175-1182
[30]   NEW ALUMINA SUBSTRATE FOR HYBRID INTEGRATED-CIRCUITS [J].
NIWA, K ;
NAKAMURA, J ;
MURAKAWA, K ;
NAKAMURA, M .
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (04) :262-266