Comments on measuring thin-film stresses using bi-layer micromachined beams

被引:67
|
作者
Fang, W
Wickert, JA
机构
[1] Dept. of Mech. Eng, Carnegie Mellon Univ., Pittsburgh, PA
关键词
D O I
10.1088/0960-1317/5/4/003
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Bi-layer structures are formed by depositing a thin pre-stressed film onto an existing micromachined beam which is made of a base-layer material. The resulting static deformation of the built-up beam is measured through optical profilometry, and the mean residual strain in the thin film is determined by calibrating a strain-deflection model to the measurements. The method is demonstrated with AlCu and diamond-like carbon films that are deposited onto SiO2 cantilevers produced through bulk machining. Critical to the technique is the inclusion of initial and non-ideal deflections of the base-layer cantilever, which have not been reported in previous investigations of the bi-layer method and which can play a significant role in determining the film's stresses.
引用
收藏
页码:276 / 281
页数:6
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