LINEAR THERMAL-EXPANSION COEFFICIENT AND BIAXIAL ELASTIC-MODULUS OF DIAMOND-LIKE CARBON-FILMS

被引:28
|
作者
BLECH, IA
WOOD, P
机构
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D O I
10.1116/1.578800
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Diamondlike carbon films were deposited on silicon, gallium arsenide and aluminum substrates using ion-assisted chemical vapor deposition. The stress of these films was measured as a function of temperature between 25 and 150-degrees-C. Using the stress-temperature measurements, the average linear thermal expansion coefficient was found to be 2.3 ppm/degrees-C, while the biaxial elastic modulus 1.74 X 10(11) Pa.
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页码:728 / 729
页数:2
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