LINEAR THERMAL-EXPANSION COEFFICIENT AND BIAXIAL ELASTIC-MODULUS OF DIAMOND-LIKE CARBON-FILMS

被引：28

作者：

BLECH, IA

WOOD, P

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1993年 / 11卷 / 03期

关键词：

D O I：

10.1116/1.578800

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Diamondlike carbon films were deposited on silicon, gallium arsenide and aluminum substrates using ion-assisted chemical vapor deposition. The stress of these films was measured as a function of temperature between 25 and 150-degrees-C. Using the stress-temperature measurements, the average linear thermal expansion coefficient was found to be 2.3 ppm/degrees-C, while the biaxial elastic modulus 1.74 X 10(11) Pa.

引用

页码：728 / 729

页数：2

共 5 条

[1] MEASUREMENT OF THERMAL-EXPANSION COEFFICIENTS OF W, WSI, WN, AND WSIN THIN-FILM METALLIZATIONS [J].