PECVD DIAMOND FILMS FOR USE IN SILICON MICROSTRUCTURES

被引：1

作者：

HERB, JA ^{[1
]}

PETERS, MG ^{[1
]}

TERRY, SC ^{[1
]}

JERMAN, JH ^{[1
]}

机构：

[1] IC SENSORS,MILPITAS,CA 95035

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 1990年 / 23卷 / 1-3期

关键词：

D O I：

10.1016/0924-4247(90)87073-R

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

PECVD techniques have been used to deposit polycrystalline diamond films that have material properties nearly identical to those of natural diamond. Diamond is the hardest known material and has the highest thermal conductivity at room temperature, while the undoped material is an excellent insulator. These and other mechanical, chemical and electrical properties make diamond films attractive for use in applications such as optics, electronic packaging and parts with low wear rates. An X-ray window device has been fabricated using a diamond window and a micromachined silicon substrate. © 1990.

引用

页码：982 / 987

页数：6

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