REVIEW OF FACTORS AFFECTING WARPAGE OF SILICON-WAFERS

被引:0
作者
THEBAULT, D
JASTRZEBSKI, L
机构
来源
RCA REVIEW | 1980年 / 41卷 / 04期
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中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
50
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页码:592 / 611
页数:20
相关论文
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