3-DIMENSIONAL MMIC TECHNOLOGY - A POSSIBLE SOLUTION TO MASTERSLICE MMICS ON GAAS AND SI

被引：19

作者：

TOKUMITSU, T

AIKAWA, M

KOHIYAMA, K

机构：

[1] NTT Wireless Systems Laboratories

来源：

IEEE MICROWAVE AND GUIDED WAVE LETTERS | 1995年 / 5卷 / 11期

关键词：

D O I：

10.1109/75.473525

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A novel masterslice MMIC is presented that expands the possibilities for three-dimensional (or multilayer) MMIC technology. This MMIC incorporates two levels of ground metals, resulting in an effective selection of master-array elements on the wafer surface by using the lower-level metal and a circuit-stacking effect by the upper one. X-band amplifier and receiver MMIC's on 3 x 1 and 6 x 3 array-units, respectively, are also demonstrated in very small areas.

引用

页码：411 / 413

页数：3

共 7 条

[1]

Procs. IEEE Microwave and Millimeter-Wave Monolithic Circuits Symp., (1994)

[2]

Hiraoka T., Tokumitsu T., Aikawa M., Very small wide-banc MMIC magic T’s using microstrip lines on a thin dielectric film, IEEE Trans. Microwave Theory Tech., 37, 10, pp. 1569-1575, (1989)

[3]

Tokumitsu T., Hiraoka T., Nakamoto H., Takenaka T., Multilayer MMIC using a 3 pm x 3-layer dielectric film structure, Proc. IEEE MTT-S Int. Microwave Symp., pp. 831-834, (1990)

[4]

Banba S., Ogawa H., Small-sized MMIC amplifiers using thin dielectric layers, IEEE Trans. Microwave Theory Tech., 43, 3, pp. 485-492, (1995)

[5]

Tokumitsu T., Toyoda I., Nishikawa K., Kamogawa K., Three-dimensional MMIC amplifier design and performance (in Japanese), IEICE Spring National Convention Record, (1995)

[6]

Toyoda I., Nishikawa K., Kamogawa K., Tokumitsu T., Three-dimensional MMIC X-band single-chip receiver (in Japanese), IEICE Spring National Convention Record, (1995)

[7]

Toyoda I., Hirota T., Tokumitsu T., Multilayer MMIC branch-line coupler and broad-side coupler, Proc. IEEE Microwave and Millimeter-Wave Monolithic Circuits Symp., pp. 79-82, (1992)

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