FLUXLESS AND VIRTUALLY VOIDLESS SOLDERING FOR SEMICONDUCTOR CHIPS

被引：6
作者：
MIZUISHI, K
TOKUDA, M
FUJITA, Y
机构：
[1] Kokubunji, Hitachi Ltd, Tokyo, Jpn
来源：
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1988年 / 11卷 / 04期
关键词：
D O I：
10.1109/33.16681
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
6
引用
收藏
页码：447 / 451
页数：5
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CASTELLAN GW, 1971, PHYSICAL CHEM, P27
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[6]   HOT SPOTS CAUSED BY VOIDS AND CRACKS IN THE CHIP MOUNTDOWN MEDIUM IN POWER SEMICONDUCTOR PACKAGING [J].
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