ON INFLUENCE OF STACKING FAULT ENERGY ON HIGH TEMPERATURE CREEP OF CU-AL SOLID SOLUTIONS

被引：5

|

作者：

PAHUTOVA, M

HOSTINSKY, T

CADEK, J

机构：

来源：

SCRIPTA METALLURGICA | 1969年 / 3卷 / 05期

关键词：

D O I：

10.1016/0036-9748(69)90289-0

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

引用

收藏

页码：293 / +

页数：1

相关论文

共 50 条

[21] Dorn Creep and the Influence of the Stacking Fault Energy: Case of Cu and Cu-Si.
Cornet, M.
Bertrand, C.
Trichet, M.F.
Res mechanica, 1988, 24 (01): : 47 - 84
[22] THE INFLUENCE OF STACKING-FAULT ENERGY ON CREEP
BURTON, B
ACTA METALLURGICA, 1982, 30 (05): : 905 - 910
[23] INFLUNECE OF STACKING FAULT ENERGY ON THE MICROSTRUCTURES, TENSILE AND FATIGUE PROPERTIES OF NANOSTRUCTURED Cu-Al ALLOYS
An Xianghai
Wu Shiding
Zhang Zhefeng
ACTA METALLURGICA SINICA, 2014, 50 (02) : 191 - 201
[24] MECHANICAL TWINNING MECHANISMS IN CU-AL CRYSTALS WITH VERY LOW STACKING-FAULT ENERGY
TRANCHANT, F
VERGNOL, J
DENANOT, MF
GRILHE, J
SCRIPTA METALLURGICA, 1987, 21 (03): : 269 - 272
[25] MICROMECHANICAL INVESTIGATION OF STACKING-FAULT ENERGY EFFECTS ON PNEUMATIC EROSION OF CU-AL ALLOYS
GRAHAM, D
MOTEFF, J
TABAKOFF, W
JOURNAL OF METALS, 1983, 35 (08): : A15 - A15
[26] A systematic study of the role of stacking fault energy (SFE) on shock-hardening in Cu and Cu-Al alloys
Rohatgi, A
Vecchio, KS
Gray, GT
FUNDAMENTAL ISSUES AND APPLICATIONS OF SHOCK-WAVE AND HIGH-STRAIN-RATE PHENOMENA, PROCEEDINGS, 2001, : 25 - 32
[27] Influence of Stacking Fault Energy on the Microstructures and Grain Refinement in the Cu-Al Alloys during Equal-Channel Angular Pressing
An, X. H.
Wu, S. D.
Zhang, Z. F.
NANOMATERIALS BY SEVERE PLASTIC DEFORMATION: NANOSPD5, PTS 1 AND 2, 2011, 667-669 : 379 - 384
[28] Effect of stacking fault energy and strain rate on the microstructural evolution during room temperature tensile testing in Cu and Cu-Al dilute alloys
Caballero, V
Varma, SK
JOURNAL OF MATERIALS SCIENCE, 1999, 34 (03) : 461 - 468
[29] INFLUENCE OF DIFFUSIVITY ELASTIC MODULUS AND STACKING FAULT ENERGY ON HIGH TEMPERATURE CREEP BEHAVIOR OF ALPHA BRASSES
BONESTEEL, RM
SHERBY, OD
ACTA METALLURGICA, 1966, 14 (03): : 385 - +
[30] Effect of stacking fault energy and strain rate on the microstructural evolution during room temperature tensile testing in Cu and Cu-Al dilute alloys
V. Caballero
S.K. Varma
Journal of Materials Science, 1999, 34 : 461 - 468

← 1 2 3 4 5 →