A STUDY ON THE THERMAL ASPECTS OF CHIPS IN GRINDING

被引：10
作者：
RAJMOHAN, B
RADHAKRISHNAN, V
机构：
[1] Manufacturing Engineering Section, Department of Mechanical Engineering, IIT, Madras
来源：
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE | 1992年 / 32卷 / 04期
关键词：
D O I：
10.1016/0890-6955(92)90045-I
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Heat transfer theory is applied to the grinding process to obtain a model for the chip temperature in dry surface grinding. This model predicts the temperature of the chips with respect to time as they leave the grinding zone. Chips produced in grinding are small and their sizes vary considerably. Their temperatures vary with respect to time or the distance from the wheel-work interface. This model is of use in understanding the spark intensities produced in grinding.
引用
收藏
页码：563 / 569
页数：7
相关论文
共 12 条
  • [1] Duwell, Hong, McDonald, The effect of oxygen and water on the dynamics of chip formation during grinding, A S L E Transactions, 12, pp. 86-93, (1969)
  • [2] Outwater, Shaw, Surface temperature in grinding, Trans. ASME, pp. 73-86, (1952)
  • [3] Rajmohan, Radhakrishnan, A preliminary study on in-process monitoring of finish in surface grinding by chip radiation measurement, Proc. 2nd IMEKO TC 14 Int. Symp. on Metrology for Quality Control in Production, pp. 97-103, (1989)
  • [4] Rajmohan, Radhakrishnan, On the relationship between chip size and surface finish in surface grinding, Proc. 14th AIMTDR Conf., pp. 23-28, (1990)
  • [5] Malkin, Anderson, Thermal aspects of grinding Part 1 Energy partition, Journal of Engineering for Industry, pp. 1177-1183, (1974)
  • [6] Malkin, Specific energy and mechanisms in abrasive processes, Proc. 3rd North American Metal Working Research Conf., pp. 453-465, (1975)
  • [7] Malkin, Grinding of metals, theory and application, J. Appl. Metal Working, 3, 2, pp. 95-109, (1984)
  • [8] Malkin, Joseph, Minimum energy in abrasive processes, Wear, 32, pp. 15-23, (1975)
  • [9] Ramnath, Ramaraj, Shaw, Grinding swarf, Wear, 131, pp. 329-339, (1989)
  • [10] Pai, Ratterman, Shaw, Grinding swarf, Wear, 131, pp. 329-339, (1989)
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