COMPUTER-AIDED THERMAL DESIGN OF LSI PACKAGES

被引：1
|
作者：
BOUCHER, S
机构：
来源：
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1972年 / PHP8卷 / 02期
关键词：
D O I：
10.1109/TPHP.1972.1136559
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：44 / &
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