INTERDIFFUSION AND GRAIN ISOLATION IN CO/CR THIN-FILMS

被引：17

作者：

FENG, YC ^{[1
]}

LAUGHLIN, DE ^{[1
]}

LAMBETH, DN ^{[1
]}

机构：

[1] CARNEGIE MELLON UNIV,CTR DATA STORAGE SYST,DEPT ELECT & COMP ENGN,PITTSBURGH,PA 15213

来源：

IEEE TRANSACTIONS ON MAGNETICS | 1994年 / 30卷 / 06期

基金：

美国安德鲁·梅隆基金会; 美国国家科学基金会;

关键词：

D O I：

10.1109/20.333953

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this work, interdiffusion and grain isolation in Co/Cr films have been investigated by studying the dependence of the magnetic properties on the substrate preheating temperature as well as on post-deposition annealing processes. By choosing pure Co instead of Co-alloy, the possibility of grain isolation caused by the segregation of solute atoms from within the magnetic layer had been eliminated. It is found that both post-deposition thermal annealing and substrate preheating can effectively increase the isolation of the Co grains.

引用

页码：3948 / 3950

页数：3

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