INTEGRATION OF EFFORTS FOR THE RELIABILITY OF MICROELECTRONIC DEVICES

被引：3
作者：
GERLING, W
机构：
[1] SIEMENS AG, Semiconductor Group, München, 81617
来源：
QUALITY AND RELIABILITY ENGINEERING INTERNATIONAL | 1994年 / 10卷 / 04期
关键词：
MICROELECTRONIC DEVICE RELIABILITY; BUILDING-IN RELIABILITY; ROBUST DESIGN; LOW PPM FAILURE; DEFECT DENSITY; TECHNOLOGY QUALIFICATION; AUDIT PROCEDURES; RELIABILITY MODELING;
D O I：
10.1002/qre.4680100403
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The expected levels of product reliability will no longer be measurable at product qualification. The control of reliability must be completely changed to proactive measures. This requires close customer-vendor relationships in early phases of specification and qualification, basic solutions by robust design and tough manufacturing engineering with zero defect targets. This changing situation is illustrated by some examples in the very diverse held of contributions to reliability. Improved cooperation is required for more efficient reliability progress.
引用
收藏
页码：255 / 261
页数：7
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