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SELECTIVE ETCHING OF SILICON DIOXIDE USING REACTIVE ION ETCHING AND CF4-H2
被引:0
|
作者
:
EPHRATH, LM
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
EPHRATH, LM
[
1
]
机构
:
[1]
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
来源
:
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
|
1977年
/ 124卷
/ 08期
关键词
:
D O I
:
暂无
中图分类号
:
O646 [电化学、电解、磁化学];
学科分类号
:
081704 ;
摘要
:
引用
收藏
页码:C284 / C284
页数:1
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