SIMULATION OF HIGH-SPEED INTERCONNECTS USING A CONVOLUTION-BASED HIERARCHICAL PACKAGING SIMULATOR

被引:9
作者
BASEL, MS [1 ]
STEER, MB [1 ]
FRANZON, PD [1 ]
机构
[1] N CAROLINA STATE UNIV,DEPT ELECT & COMP ENGN,ELECTR RES LAB,RALEIGH,NC 27695
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1995年 / 18卷 / 01期
基金
美国国家科学基金会;
关键词
D O I
10.1109/96.365492
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A specialized packaging simulator is presented which uses an impulse response model of the interconnect network to model high speed digital systems. Behavioral models of drivers and receivers are used. A hierarchical strategy is developed which uses point modeling of discontinuities and the concept of coupling groups to facilitate tradeoffs between accuracy and run time. A new impulse response/convolution technique is developed to efficiently handle large distributed interconnect networks. With this technique, impulse response thresholding provides a smooth transistion from delay modeling of interconnects to full distributed circuit simulation.
引用
收藏
页码:74 / 82
页数:9
相关论文
共 46 条
[1]  
ALAYBEYI MM, 1992, IEEE INT C COMPUTER, P341
[2]   A UNIVERSAL MODEL FOR LOSSY AND DISPERSIVE TRANSMISSION-LINES FOR TIME DOMAIN CAD OF CIRCUITS [J].
ALONSO, JI ;
BORJA, J ;
PEREZ, F .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1992, 40 (05) :938-947
[3]  
ALONSO JI, 1992, IEEE T CIRCUITS SYST, V39
[4]   TIME AND FREQUENCY-DOMAIN CHARACTERIZATION OF MULTICONDUCTOR TRANSMISSION-LINES [J].
ARABI, TR ;
SARKAR, TK ;
DJORDJEVIC, AR .
ELECTROMAGNETICS, 1989, 9 (01) :85-112
[5]   TRANSIENT ANALYSIS AND SIMULATION OF NONUNIFORM LOSSY TRANSMISSION-LINES [J].
BANDURSKI, W .
INTERNATIONAL JOURNAL OF MICROWAVE AND MILLIMETER-WAVE COMPUTER-AIDED ENGINEERING, 1992, 2 (03) :189-202
[6]  
BARKATULLAH JS, 1991, P ACM IEEE DESIGN AU, P746
[7]  
BASEL MS, 1991, IEEE T MICROW THEORY, P987
[8]  
BASEL MS, 1993, THESIS N CAROLINA ST
[9]   TRANSIENT ANALYSIS OF LOSSY MULTICONDUCTOR TRANSMISSION-LINES IN NONLINEAR CIRCUITS [J].
BLAZECK, TS ;
MITTRA, R .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1991, 14 (03) :618-627
[10]  
BRACKEN JE, 1992, IEEE INT C COMPUTER, P71