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- [2] PLATING BLOCKOUT DURING GOLD ELECTROPLATING OF HYBRID MICROWAVE INTEGRATED-CIRCUITS PLATING AND SURFACE FINISHING, 1991, 78 (01): : 29 - 31
- [3] MULTIPROJET CIRCUIT FOR FULL CUSTOM DESIGN OF BIPOLAR INTEGRATED-CIRCUITS ANNALES DES TELECOMMUNICATIONS-ANNALS OF TELECOMMUNICATIONS, 1991, 46 (9-10): : 550 - 552
- [4] AUTOMATIC PLATING OF BIPOLAR INTEGRATED-CIRCUITS PLATING AND SURFACE FINISHING, 1982, 69 (11): : 45 - 45
- [6] HETEROJUNCTION BIPOLAR INTEGRATED-CIRCUITS TECHNOLOGY JOURNAL DE PHYSIQUE III, 1991, 1 (04): : 569 - 579
- [8] AUTOMATIC PLATING OF BIPOLAR INTEGRATED-CIRCUITS PLATING AND SURFACE FINISHING, 1984, 71 (01): : 48 - 52