EFFECT OF BIPOLAR TURN-ON ON THE STATIC CURRENT-VOLTAGE CHARACTERISTICS OF SCALED VERTICAL POWER DMOSFETS

被引:7
作者
FISCHER, KJ
SHENAI, K
机构
[1] Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, WI 53706-1691
关键词
D O I
10.1109/16.368054
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The parasitic bipolar transistor inherent in the power vertical Double Diffused MOSFET (DMOSFET) structure can have a significant impact on its performance and reliability, Selectively formed TiSi2 films on source contacts were used to reduce the contact resistance to nf Source diffusion, These devices exhibit ''kinks'' in the output I-V characteristics. High contact resistance of TiSi2 to moderately doped p-body diffusion causes high output conductance. Detailed two-dimensional numerical simulations are used to investigate the effect of the parasitic bipolar transistor on the static characteristics of scaled silicided DMOSFET's. The high contact resistance of TiSi2-p-body interface leads to a floating potential and causes significant reduction in the MOS gate threshold voltage and results in a premature bipolar turn-on, It is shown that the parasitic bipolar turn-on places an important constraint on the scalability of the device into the submicron regime, A novel self-aligned DMOSPET structure with a shallow diffused p(+) region is shown to eliminate this effect. Numerical simulations are shown to be in excellent agreement with the measured data at various temperatures.
引用
收藏
页码:555 / 563
页数:9
相关论文
共 14 条
[1]  
KENNEDY DP, 1973, DEC IEEE IEDM, P160
[2]  
Mori M., 1988, International Electron Devices Meeting. Technical Digest (IEEE Cat. No.88CH2528-8), P813, DOI 10.1109/IEDM.1988.32935
[3]  
Nakagawa A., 1986, International Electron Devices Meeting 1986. Technical Digest (Cat. No.86CH2381-2), P122
[4]   NOVEL REFRACTORY CONTACT AND INTERCONNECT METALLIZATIONS FOR HIGH-VOLTAGE AND SMART-POWER APPLICATIONS [J].
SHENAI, K .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1990, 37 (10) :2207-2221
[5]   A HIGH-DENSITY, SELF-ALIGNED POWER MOSFET STRUCTURE FABRICATED USING SACRIFICIAL SPACER TECHNOLOGY [J].
SHENAI, K .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1992, 39 (05) :1252-1255
[6]   EFFECT OF P-BASE SHEET AND CONTACT RESISTANCES ON STATIC CURRENT VOLTAGE CHARACTERISTICS OF SCALED LOW-VOLTAGE VERTICAL POWER DMOSFETS [J].
SHENAI, K .
IEEE ELECTRON DEVICE LETTERS, 1991, 12 (06) :270-272
[7]   MODELING AND CHARACTERIZATION OF DOPANT REDISTRIBUTIONS IN METAL AND SILICIDE CONTACTS [J].
SHENAI, K ;
SANGIORGI, E ;
SWANSON, RM ;
SARASWAT, KC ;
DUTTON, RW .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1985, 32 (04) :793-799
[8]   MANUFACTURABILITY ISSUES RELATED TO TRANSIENT THERMAL ANNEALING OF TITANIUM SILICIDE FILMS IN A RAPID THERMAL PROCESSOR [J].
SHENAI, K .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 1991, 4 (01) :1-8
[9]   THERMAL-STABILITY OF TISI2 FILMS ON SINGLE-CRYSTAL AND POLYCRYSTALLINE SILICON [J].
SHENAI, K .
JOURNAL OF MATERIALS RESEARCH, 1991, 6 (07) :1502-1511
[10]   OPTIMALLY SCALED LOW-VOLTAGE VERTICAL POWER MOSFETS FOR HIGH-FREQUENCY POWER CONVERSION [J].
SHENAI, K .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1990, 37 (04) :1141-1153