EFFECT OF ULTRASONIC VIBRATION ON WIRE BONDING

被引：1
|
作者：
HAJI, H
MORITA, T
NAKASHIMA, H
YOSHINAGA, H
机构：
来源：
JOURNAL OF THE JAPAN INSTITUTE OF METALS | 1993年 / 57卷 / 08期
关键词：
WIRE BONDING; ULTRASONIC VIBRATION; ALUMINUM; GOLD; COPPER; COMPRESSION TEST;
D O I：
10.2320/jinstmet1952.57.8_884
中图分类号：
学科分类号：
摘要：
In order to investigate the effect of ultraronic vibration on wire bonding, an apparatus which enabled compression tests under ultrasonic vibration in a wide range of frequency and amplitude was developed. High purity gold, aluminum and copper specimens were used for the compression test. The apparatus was applied also to the practical wire bonding. The results obtained are as follows. (1) The flow stress is reduced by superimposing the ultrasonic vibration. The stress reduction increases with the increase in frequency and amplitude. (2) The shear strength of wire-bonded interface increases also with the increase in frequency and amplitude. From these results, the effects of ultrasonic vibration on wire bonding are discussed.
引用
收藏
页码：884 / 889
页数：6
相关论文
共 50 条
  • [1] Vibration Characteristics of a Wire-Bonding Ultrasonic Horn
    Kim, Young Woo
    Yim, Vit
    Han, Daewoong
    Lee, Seung-Yop
    TRANSACTIONS OF THE KOREAN SOCIETY OF MECHANICAL ENGINEERS A, 2014, 38 (02) : 227 - 233
  • [2] Vibration characteristic researching of capillary of ultrasonic wire bonding
    Feng, Wuwei, 1600, Transport and Telecommunication Institute, Lomonosova street 1, Riga, LV-1019, Latvia (18):
  • [3] Study on vibration characteristics of capillary in an ultrasonic wire bonding system
    School of Mechanical Engineering, Xi'an Jiaotong University, Xi'an 710049, China
    不详
    Zhendong yu Chongji/Journal of Vibration and Shock, 2007, 26 (07): : 106 - 110
  • [4] The effect of ultrasonic power on bonding pad and IMD layers in ultrasonic wire bonding
    Jeon, IS
    Chung, QH
    Hong, JK
    Lyun, KY
    ADVANCES IN ELECTRONIC MATERIALS AND PACKAGING 2001, 2001, : 235 - 242
  • [5] Effect of ultrasonic power on the wire bonding strength
    College of Mechanical and Electronical Engineering, Central South University, Changsha 410083, China
    Jixie Gongcheng Xuebao, 2007, 3 (107-111):
  • [6] Effect of ultrasonic vibration on the process of wire drawing
    Duman, Onur
    Kulekci, Mustafa Kemal
    PAMUKKALE UNIVERSITY JOURNAL OF ENGINEERING SCIENCES-PAMUKKALE UNIVERSITESI MUHENDISLIK BILIMLERI DERGISI, 2019, 25 (04): : 440 - 443
  • [7] BRITTLE CRACKS INDUCED IN ALSI WIRE BY THE ULTRASONIC BONDING TOOL VIBRATION
    FITZSIMMONS, RT
    MILLER, CE
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1991, 14 (04): : 838 - 842
  • [8] WELDING CHARACTERISTICS OF THIN COPPER WIRE USING COMPLEX VIBRATION ULTRASONIC WIRE BONDING SYSTEMS
    TSUJINO, J
    MURAYAMA, Y
    FURUYA, H
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1990, 29 : 173 - 175
  • [9] ULTRASONIC BONDING OF INSULATED WIRE
    HULST, AP
    LASANCE, C
    WELDING JOURNAL, 1978, 57 (02) : 19 - 25
  • [10] Wire drawing with ultrasonic vibration
    Li, Lianshi
    Lang, Xiaoping
    Wire Industry, 1994, 61 (721):
12345