A NEW WAFER-LEVEL ISOTHERMAL JOULE-HEATED ELECTROMIGRATION TEST FOR RAPID TESTING OF INTEGRATED-CIRCUIT INTERCONNECT

被引：32
作者：
JONES, RE
SMITH, LD
机构：
来源：
JOURNAL OF APPLIED PHYSICS | 1987年 / 61卷 / 09期
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D O I：
10.1063/1.338378
中图分类号：
O59 [应用物理学];
学科分类号：
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页码：4670 / 4678
页数：9
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