EFFECTIVE THERMOMECHANICAL BEHAVIOR OF PLAIN-WEAVE FABRIC-REINFORCED COMPOSITES USING HOMOGENIZATION THEORY

A micromechanical analysis is presented to obtain the effective macroscale orthotropic thermomechanical behavior of plain-weave fabric reinforced laminated composites based on a two-scale asymptotic homogenization theory. The model is based on the properties of the constituents and an accurate, three-dimensional simulation of the weave microarchitecture, and is used for predicting the thermomechanical behavior of glass-epoxy (FR-4) woven-fabric laminates typically used by the electronics industry in Multilayered Printed Wiring Boards (MLBs). Parametric studies are conducted to examine the effect of varying fiber volume fractions on constitutive properties. Nonlinear constitutive behavior due to matrix nonlinearity and postdamage behavior due to transverse yam failure under in-plane uniaxial loads is then investigated. Numerical results obtained from the model show good agreement with experimental values and with data from the literature. This model may be utilized by material designers to design and manufacture fabric reinforced composites with tailored effective properties such as elastic moduli, shear moduli, Poisson's ratio, and coefficients of thermal expansion.