THE POLYIMIDE (PMDA/ODA)-TITANIUM INTERFACE .1. UNTREATED PMDA/ODA - AN XPS, AES, AFM AND RAMAN-STUDY

被引:17
作者
GIRARDEAUX, C
DRUET, E
DEMONCY, P
DELAMAR, M
机构
[1] UNIV PARIS 07,INST TOPOL & DYNAM SYST,F-75005 PARIS,FRANCE
[2] IBM CORP,LAB ETUDE SURFACES & STRUCT,SERV 1807 31U,F-91105 CORBEIL ESSONNES,FRANCE
关键词
AES; AFM; PMDA/ODA; POLYIMIDE; RAMAN; XPS;
D O I
10.1016/0368-2048(94)02218-O
中图分类号
O433 [光谱学];
学科分类号
0703 ; 070302 ;
摘要
The interface between evaporated titanium and PMDA/ODA (pyromellitic dianhydride oxidianiline) polyimide is examined using several techniques: X-ray photoelectron spectroscopy, Auger spectroscopy, atomic force microscopy (AFM), Raman spectroscopy and peel strength measurements. The formation of small TiO2 particles at this interface (15-40 mu m diameter, about 30 nm thickness, covering about 6% of the interfacial area) is demonstrated. The failure is of cohesive type in the polymer layer. When the residual pressure during titanium evaporation is increased, the number of TiO2 particles increases, adhesion of the titanium layer is lowered and the locus of failure is closer to the metal layer.
引用
收藏
页码:11 / 21
页数:11
相关论文
共 34 条
[31]  
STAFSTROM S, 1990, ACS S SER, V440, pCH23
[32]   INTERACTION OF EVAPORATED COPPER WITH VAPOR-DEPOSITED THIN POLYIMIDE FILMS [J].
STRUNSKUS, T ;
HAHN, C ;
FRANKEL, D ;
GRUNZE, M .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 1991, 9 (03) :1272-1277
[33]   INTERDIFFUSION AT THE POLYIMIDE-CU INTERFACE [J].
TROMP, RM ;
LEGOUES, F ;
HO, PS .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (03) :782-785
[34]   CR-POLYIMIDE AND CU-POLYIMIDE INTERFACE - CHEMISTRY AND STRUCTURE [J].
WHITE, RC ;
HAIGHT, R ;
SILVERMAN, BD ;
HO, PS .
APPLIED PHYSICS LETTERS, 1987, 51 (07) :481-483