CORROSION FAILURE MECHANISMS FOR GOLD METALLIZATIONS IN ELECTRONIC CIRCUITS

被引：32
|
作者：
FRANKENTHAL, RP [1 ]
BECKER, WH [1 ]
机构：
[1] BELL TEL LABS INC, READING, PA 19604 USA
来源：
JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1979年 / 126卷 / 10期
关键词：
D O I：
10.1149/1.2128783
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
引用
收藏
页码：1718 / 1719
页数：2
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