PLANNING FOR MANUFACTURE OF THICK-FILM HYBRID CIRCUITS IN INDIA

被引：0

作者：

JAIN, AK

机构：

来源：

ELECTRONICS INFORMATION & PLANNING | 1978年 / 5卷 / 06期

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D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：428 / 449

页数：22

共 50 条

[1] THICK-FILM HYBRID CIRCUITS CHARACTERISTICS, MANUFACTURE AND APPLICATION
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