LENGTH DEPENDENCE OF THE RESISTANCE IN THIN COPPER WIRES

被引:0
|
作者
CHIN, A [1 ]
MASDEN, JT [1 ]
HUSSEIN, NM [1 ]
机构
[1] SO ILLINOIS UNIV,MOLEC SCI PROGRAM,CARBONDALE,IL 62901
关键词
D O I
10.1016/0038-1098(89)90668-6
中图分类号
O469 [凝聚态物理学];
学科分类号
070205 ;
摘要
引用
收藏
页码:661 / 663
页数:3
相关论文
共 50 条
  • [31] Nonexponential Length Dependence of Molecular Conductance in Acene-Based Molecular Wires
    Valdiviezo, Jesus
    Rocha, Paulina
    Polakovsky, Anastazia
    Palma, Julio L.
    ACS SENSORS, 2021, 6 (02) : 477 - 484
  • [32] Length dependence of the longitudinal optical phonon properties in CdZnSe/ZnSe quantum wires
    Schreder, B
    Materny, A
    Kiefer, W
    Kümmell, T
    Bacher, G
    Forchel, A
    Landwehr, G
    SOLID STATE COMMUNICATIONS, 2000, 114 (08) : 435 - 440
  • [33] Stress dependence of switching field in ultra-thin amorphous wires
    Cobeño, AF
    Aragoneses, P
    Blanco, JM
    Dominguez, L
    Zhukov, A
    Larin, V
    González, J
    MAGNETISM, MAGNETIC MATERIALS AND THEIR APPLICATIONS, 1999, 302-3 : 244 - 248
  • [34] Experimental setup to analyze the relation between Resistance and Length on SMA wires
    Branciforte, Marco
    La Rosa, Fabrizio
    Muscato, Giovanni
    Fonti, Andrea
    2012 FIRST INTERNATIONAL CONFERENCE ON INNOVATIVE ENGINEERING SYSTEMS (ICIES), 2012, : 81 - 85
  • [35] DEVICES FOR HEAT-RESISTANCE TESTS OF THIN FIBERS AND WIRES
    KOSAREV, AI
    KOSAREV, EA
    NEIMAN, SM
    INDUSTRIAL LABORATORY, 1979, 45 (11): : 1302 - 1304
  • [36] Experimental Study on Underwater Electrical Explosion of Copper Wires With Varied Diameter and Length
    Shi H.
    Fan Y.
    Yin G.
    Zhang Z.
    Li X.
    Qiu A.
    Gaodianya Jishu/High Voltage Engineering, 2021, 47 (07): : 2599 - 2606
  • [37] SOLDER TESTS - CHOICE OF SOLDER FOR FINE WIRES AND THIN COPPER FILMS
    ALLEN, BM
    WIRELESS WORLD, 1972, 78 (1436): : 75 - +
  • [38] REDUCTION OF THE RESIDUAL RESISTIVITY OF THIN COPPER-WIRES BY INTERNAL OXIDATION
    PETERSEIM, J
    THUMMES, G
    HORSTMENDE, H
    ZEITSCHRIFT FUR METALLKUNDE, 1979, 70 (04): : 266 - 270
  • [39] Nucleate boiling on thin copper wires with micropatterned superhydrophobic and hydrophilic areas
    Wang, Xinwei
    Wang, Hao
    CHINESE SCIENCE BULLETIN-CHINESE, 2020, 65 (17): : 1734 - 1740
  • [40] The effect of low stresses on creep and surface profiles of thin copper wires
    Srivastava, V
    McNee, KR
    Jones, H
    Greenwood, GW
    ACTA MATERIALIA, 2003, 51 (15) : 4611 - 4619