THE EFFECT OF SUBSTRATE-TEMPERATURE ON THE ELECTRICAL-PROPERTIES OF THIN CHROMIUM FILMS

被引：23

作者：

ANGADI, MA

UDACHAN, LA

机构：

来源：

JOURNAL OF MATERIALS SCIENCE | 1981年 / 16卷 / 05期

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D O I：

10.1007/BF01033860

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

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页码：1412 / 1415

页数：4

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共 11 条

[1] ASHRIT PV, J PHYS F
[2] ASHRIT PV, 1981, PHYS STAT SOL A, V63
[3] TEMPERATURE COEFFICIENTS OF RESISTANCE OF METALLIC FILMS IN THE TEMPERATURE RANGE 25-DEGREES-C TO 600-DEGREES-C
BELSER, RB
HICKLIN, WH
[J]. JOURNAL OF APPLIED PHYSICS, 1959, 30 (03) : 313 - 322
[4] INFLUENCE OF DEPOSITION PARAMETERS ON COALESCENCE STAGE OF GROWTH OF METAL FILMS
CHOPRA, KL
RANDLETT, MR
[J]. JOURNAL OF APPLIED PHYSICS, 1968, 39 (03) : 1874 - &
[5] LARSON DC, 1971, PHYS THIN FILMS, V6, P85
[6] NUCLEATION AND EPITAXIAL GROWTH OF CU ON W
MELMED, AJ
[J]. JOURNAL OF APPLIED PHYSICS, 1965, 36 (11) : 3585 - &
[7] Neugebauer C., 1964, PHYS THIN FILMS, VII, P1
[8] ELECTRICAL PROPERTIES OF VACUUM-EVAPORATED COPPER-FILMS
PAL, AK
SEN, P
BARUA, AK
[J]. THIN SOLID FILMS, 1975, 25 (01) : S25 - S28
[9] SHIVAPRASAD SM, J PHYS D
[10] UDACHAN LA, 1980, PHYS STAT SOL A, V60