MICROWAVE CONDUCTIVITY OF THICK-FILM CONDUCTORS

被引：4

作者：

PATEL, RN

机构：

来源：

关键词：

D O I：

10.1049/el:19700320

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：455 / &

共 50 条

[1] EFFECT OF PROCESS VARIABLES ON MICROWAVE CONDUCTIVITY OF THICK-FILM CONDUCTORS
CORKHILL, JR
ODONNELL, ER
ELECTRONICS LETTERS, 1972, 8 (20) : 500 - &
[2] ADVANCES IN THICK-FILM CONDUCTORS FOR MICROWAVE INTEGRATED-CIRCUITS
JOHNSON, RW
RICH, PW
RICH, DD
WILSON, LK
ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1980, 6 (3-4): : 215 - 218
[3] ADHERENCE OF THICK-FILM CONDUCTORS
BECHER, PF
REPORT OF NRL PROGRESS, 1976, (DEC): : 36 - 37
[4] ADVANCES IN THICK-FILM CONDUCTORS
STEIN, SJ
SPADAFORA, L
HUANG, C
AMERICAN CERAMIC SOCIETY BULLETIN, 1977, 56 (03): : 325 - 325
[5] ADHESION MECHANISMS OF THICK-FILM CONDUCTORS
KIM, HG
ROTHLINGSHOFER, W
TOMANDL, G
SOLID STATE TECHNOLOGY, 1979, 22 (03) : 62 - 66
[6] COST EFFICIENCY OF THICK-FILM CONDUCTORS
RIEMER, DE
SOLID STATE TECHNOLOGY, 1975, 18 (10) : 42 - 45
[7] NEW DEVELOPMENTS IN THICK-FILM CONDUCTORS
STEIN, SJ
SPADAFORA, L
HUANG, C
SOLID STATE TECHNOLOGY, 1979, 22 (01) : 74 - 80
[8] BASE-METAL THICK-FILM CONDUCTORS
STEIN, SJ
HUANG, C
CANG, L
SOLID STATE TECHNOLOGY, 1981, 24 (01) : 73 - 79
[9] RELIABILITY OF THICK-FILM CONDUCTORS IN HUMID ENVIRONMENT
NAKADA, Y
AMERICAN CERAMIC SOCIETY BULLETIN, 1981, 60 (03): : 402 - 402
[10] Silver-palladium thick-film conductors
Wang, Sea Fue, 1600, American Ceramic Soc, Westerville, OH, United States (77):