HIGH-DENSITY PROGRAMMABLE LOGIC ARRAY CHIP

被引：0
|
作者：
WOOD, RA
机构：
来源：
IEEE TRANSACTIONS ON COMPUTERS | 1979年 / 28卷 / 09期
关键词：
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：602 / 608
页数：7
相关论文
共 50 条
  • [21] INTRODUCTION TO PROGRAMMABLE ARRAY LOGIC
    COLI, VJ
    BYTE, 1987, 12 (01): : 207 - &
  • [22] PROGRAMMABLE LOGIC ARRAY.
    Anon
    1600, (28):
  • [23] AN ALTERABLE PROGRAMMABLE LOGIC ARRAY
    MARCHAND, JFP
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1985, 20 (05) : 1061 - 1066
  • [24] HIGH-DENSITY ZERO SUPPRESSOR AND ENCODER VME BOARD USING FIELD-PROGRAMMABLE GATE ARRAY
    ALOISIO, A
    CEVENINI, F
    PATRICELLI, S
    PARASCANDOLO, P
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1994, 41 (01) : 225 - 227
  • [25] FORMAL LOGIC SYNTHESIS FOR PROGRAMMABLE LOGIC ARRAY
    HEATH, C
    WILLIAMSON, I
    ELECTRONIC ENGINEERING, 1976, 48 (583): : 53 - 56
  • [26] Fiber Array Unit with Reduced Clad Fibers for High-Density Fiber-Chip Coupling
    Bickham, Scott R.
    Kuang, Wen-Lung
    Feng, Ximao
    2019 IEEE CPMT SYMPOSIUM JAPAN (ICSJ), 2019, : 59 - 62
  • [27] HIGH-DENSITY CHIP CARRIERS COMPETE WITH DIPS
    YATES, W
    ELECTRONIC PRODUCTS MAGAZINE, 1980, 23 (06): : 27 - 32
  • [28] CHIP CARRIERS AS A MEANS FOR HIGH-DENSITY PACKAGING
    PROKOP, JS
    WILLIAMS, DW
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1978, 1 (03): : 297 - 304
  • [29] Flex-on-chip for high-density packaging
    Fjelstad, Joseph
    DiStefano, Thomas
    Surface mount technology, 1995, 9 (08):
  • [30] HIGH-SPEED STATIC PROGRAMMABLE LOGIC ARRAY IN LOCMOS
    MAY, P
    SCHIERECK, FC
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1976, 11 (03) : 365 - 369
12345