SOLDER GLASS SEALS IN SEMI-CONDUCTOR PACKAGING

被引：0

作者：

FORBES, DWA

机构：

来源：

GLASS TECHNOLOGY | 1967年 / 8卷 / 02期

关键词：

D O I：

暂无

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：32 / +

页数：1

共 33 条

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