ELECTRODEPOSITION OF METALS INTO POROUS SILICON

被引：121

作者：

JESKE, M ^{[1
]}

SCHULTZE, JW ^{[1
]}

THONISSEN, M ^{[1
]}

MUNDER, H ^{[1
]}

机构：

[1] FORSCHUNGSZENTRUM JULICH, FORSCHUNGSZENTRUM, INST SCHICHT & IONENTECH, D-52425 JULICH, GERMANY

来源：

THIN SOLID FILMS | 1995年 / 255卷 / 1-2期

关键词：

DEPOSITION PROCESS; METALLIZATION; SILICON; X-RAY PHOTOELECTRON SPECTROSCOPY;

D O I：

10.1016/0040-6090(94)05605-D

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The electroless and cathodic electrodeposition of metals (Au, Cu, Ni) into porous silicon (PS) is studied. The electrochemically modified PS layers are analysed by X-ray photoelectron spectroscopy and sputter depth profiling. The electroless deposition oxidizes PS simultaneously. For this reaction a new concept of injection current multiplication is proposed. After cathodic metal deposition the pores are filled with metal quantitatively without oxidation of PS.

引用

页码：63 / 66

页数：4

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