THE DEPOSITION AND FILM PROPERTIES OF REACTIVELY SPUTTERED TITANIUM NITRIDE

被引：34

作者：

ELLWANGER, RC ^{[1
]}

TOWNER, JM ^{[1
]}

机构：

[1] SIGNET CORP,PHILIPS RES LABS SUNNYVALE,SUNNYVALE,CA 94088

来源：

THIN SOLID FILMS | 1988年 / 161卷

关键词：

D O I：

10.1016/0040-6090(88)90261-1

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：289 / 304

页数：16

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