AN OVERVIEW OF MULTICHIP MODULES

被引：0
|
作者：
LALL, P
BHAGATH, S
机构：
来源：
SOLID STATE TECHNOLOGY | 1993年 / 36卷 / 09期
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Multichip packaging provides one means of achieving high chip densities, shorter interconnection lengths, and improved IC system performance. This paper provides an overall perspective of multichip module (MCM) capabilities, size, speed, applications, materials, manufacturing processes, and cost.
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页码：65 / &
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