Numerical and experimental study of the mesa configuration in high-voltage 4H-SiC PiN rectifiers

被引:1
|
作者
Deng, Xiao-Chuan [1 ]
Chen, Xi-Xi [1 ]
Li, Cheng-Zhan [2 ]
Shen, Hua-Jun [3 ]
Zhang, Jin-Ping [1 ]
机构
[1] Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Peoples R China
[2] Zhuzhou CSR Times Elect Co Ltd, Power Elect Business Unit, Zhuzhou 412001, Peoples R China
[3] Chinese Acad Sci, Inst Opt & Elect, Chengdu 610209, Peoples R China
基金
中国国家自然科学基金;
关键词
silicon carbide; mesa configuration; PiN rectifier; breakdown voltage; DIODES;
D O I
10.1088/1674-1056/25/8/087201
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
The effect of the mesa configuration on the reverse breakdown characteristic of a SiC PiN rectifier for high-voltage applications is analyzed in this study. Three geometrical parameters, i.e., mesa height, mesa angle and mesa bottom corner, are investigated by numerical simulation. The simulation results show that a deep mesa height, a small mesa angle and a smooth mesa bottom (without sub-trench) could contribute to a high breakdown voltage due to a smooth and uniform surface electric field distribution. Moreover, an optimized mesa structure without sub-trench (mesa height of 2.2 mu m and mesa angle of 20 degrees) is experimentally demonstrated. A maximum reverse blocking voltage of 4 kV and a forward voltage drop of 3.7 V at 100 A/cm(2) are obtained from the fabricated diode with a 30-mu m thick N- epi-layer, corresponding to 85% of the ideal parallel-plane value. The blocking characteristic as a function of the JTE dose is also discussed for the PiN rectifiers with and without interface charge.
引用
收藏
页数:5
相关论文
共 50 条
  • [11] High-voltage (3 kV) UMOSFETs in 4H-SiC
    Li, Y
    Cooper, JA
    Capano, MA
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2002, 49 (06) : 972 - 975
  • [12] Experimental Demonstration of High-Voltage 4H-SiC Bi-Directional IGBTs
    Chowdhury, Sauvik
    Hitchcock, Collin
    Stum, Zachary
    Dahal, Rajendra P.
    Bhat, Ishwara B.
    Chow, T. Paul
    IEEE ELECTRON DEVICE LETTERS, 2016, 37 (08) : 1033 - 1036
  • [13] Experimental and numerical analyses of high voltage 4H-SiC junction barrier Schottky rectifiers with linearly graded field limiting ring
    王向东
    邓小川
    王永维
    王勇
    文译
    张波
    ChinesePhysicsB, 2014, 23 (05) : 494 - 498
  • [14] Experimental and numerical analyses of high voltage 4H-SiC junction barrier Schottky rectifiers with linearly graded field limiting ring
    Wang Xiang-Dong
    Deng Xiao-Chuan
    Wang Yong-Wei
    Wang Yong
    Wen Yi
    Zhang Bo
    CHINESE PHYSICS B, 2014, 23 (05)
  • [15] Edge-Termination Technique for High-Voltage Mesa-Structure 4H-SiC Devices: Negative Beveling
    N. M. Lebedeva
    N. D. Il’inskaya
    P. A. Ivanov
    Semiconductors, 2020, 54 : 258 - 262
  • [16] Improved high-voltage lateral RESURF MOSFETs in 4H-SiC
    Banerjee, S
    Chatty, K
    Chow, TP
    Gutmann, RJ
    IEEE ELECTRON DEVICE LETTERS, 2001, 22 (05) : 209 - 211
  • [17] High-voltage accumulation-layer UMOSFET's in 4H-SiC
    Tan, J
    Cooper, JA
    Melloch, MR
    IEEE ELECTRON DEVICE LETTERS, 1998, 19 (12) : 487 - 489
  • [18] On the homogeneity of the turn-on process in high-voltage 4H-SiC thyristors
    Levinshtein, ME
    Ivanov, PA
    Agarwal, AK
    Palmour, JW
    SOLID-STATE ELECTRONICS, 2005, 49 (02) : 233 - 237
  • [19] Recent advances in 4H-SiC epitaxy for high-voltage power devices
    Tsuchida, Hidekazu
    Kamata, Isaho
    Miyazawa, Tetsuya
    Ito, Masahiko
    Zhang, Xuan
    Nagano, Masahiro
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2018, 78 : 2 - 12
  • [20] High-temperature performance of 10 kilovolts, 200 amperes (pulsed) 4H-SiC PiN rectifiers
    Singh, R
    Irvine, KG
    Richmond, JT
    Palmour, JW
    SILICON CARBIDE AND RELATED MATERIALS 2001, PTS 1 AND 2, PROCEEDINGS, 2002, 389-3 : 1265 - 1268