CHEMICAL EVALUATION OF CU POLYIMIDE INTERFACES

被引:17
作者
DAVIS, GD
REES, BJ
WHISNANT, PL
机构
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1994年 / 12卷 / 04期
关键词
D O I
10.1116/1.579218
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The interactions of copper overlayers with four different polyimides [pyromellitic dianhydride-oxydianiline (PMDA-ODA), benzophenonetetracarboxylic dianhydride-diaminobenzophenone (BTDA-DABP); oxydiphthalic anhydride-oxydianiline (ODPA-ODA); and pyromellitic dianhydride-phenylene diamine (PMDA-PDA)] have been studied by x-ray photoelectron spectroscopy. Emergent etherlike functionalities on polyimides without innate ether groups suggest a copper-induced partial reduction of carbonyl groups. A surface behavior diagram of the carbon chemistry confirms this reaction by indicating a partial conversion of carbonyl moieties to etherlike moieties.
引用
收藏
页码:2378 / 2387
页数:10
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