DOSING AND CONTROLLING OF CHIP GLUING AND CHIP SPREADING IN PARTICLE BOARD PRODUCTION

被引:1
|
作者
ARNOLD, D [1 ]
机构
[1] CARL SCHENCK AG,DARMSTADT,FED REP GER
关键词
D O I
10.1007/BF02608424
中图分类号
TB3 [工程材料学]; TS [轻工业、手工业、生活服务业];
学科分类号
0805 ; 080502 ; 0822 ;
摘要
引用
收藏
页码:359 / 363
页数:5
相关论文
共 50 条
  • [41] Laser removal of flux residue before chip attachment to board in a flip chip assembly
    Lu, JC
    Li, YS
    Zong, XF
    Wu, JH
    Tay, YH
    Lim, TB
    JOURNAL OF ELECTRONICS MANUFACTURING, 1998, 8 (3-4): : 173 - 179
  • [42] Influence of optical interconnects at the chip and board levels
    Aicher, W
    Haberger, K
    OPTICAL ENGINEERING, 1999, 38 (02) : 313 - 322
  • [43] CHIP-ON-BOARD TECHNOLOGY CHUGS ALONG
    CHIN, S
    ELECTRONIC PRODUCTS MAGAZINE, 1987, 29 (19): : 37 - 40
  • [44] ESD Interference at the Chip- and Board Level
    Koenig, Sven
    Glasser, Lars
    2018 IEEE SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SIGNAL INTEGRITY AND POWER INTEGRITY (EMC, SI & PI), 2018,
  • [45] Reliability assessment of flip chip on board connections
    Teo, KH
    2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS, 1998, : 269 - 273
  • [46] Status of NCMS chip-on-board project
    Janus, AR
    1997 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES - PROCEEDINGS, 1997, : 177 - 180
  • [47] Solder alloy selection for flip chip on board
    Rinne, Glenn A.
    Magill, Paul A.
    Machon, Wayne C.
    Mis, J.Daniel
    Baggs, Joseph W.
    Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, 1998, : 118 - 122
  • [48] CHIP ON HOLE PRINTED-CIRCUIT BOARD
    TANIMOTO, M
    EDO, K
    OKITA, K
    SHIGEMASA, J
    SHARP TECHNICAL JOURNAL, 1991, (51): : 77 - 80
  • [50] Electrochemical immunosensing on board microfluidic chip platforms
    Hervas, Mirian
    Lopez, Miguel A.
    Escarpa, Alberto
    TRAC-TRENDS IN ANALYTICAL CHEMISTRY, 2012, 31 : 109 - 128