INFLUENCE OF AL OXIDE FILM ON THERMOCOMPRESSION BONDING OF AU WIRE TO EVAPORATED AL FILM

被引：2

作者：

IWATA, S

ISHIZAKA, A

YAMAMOTO, H

机构：

来源：

关键词：

Compendex;

D O I：

10.2320/jinstmet1952.45.6_603

中图分类号：

学科分类号：

摘要：

Integrated circuit manufacture

引用

页码：603 / 609

页数：7

共 6 条

[1] COTTRELL AH, 1964, MECHANICAL PROPERTIE, P332
[2] SI-SIO2 INTERFACE CHARACTERIZATION BY ESCA
ISHIZAKA, A
IWATA, S
KAMIGAKI, Y
[J]. SURFACE SCIENCE, 1979, 84 (02) : 355 - 374
[3] CORROSION TEST FOR METALLIZATION FOR PLASTIC-ENCAPSULATED ICS
IWATA, S
ISHIZAKA, A
YAMAMOTO, H
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (01) : 110 - 114
[4] EVOLUTION OF DIGITAL ELECTRONICS TOWARDS VLSI
KEYES, RW
[J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1979, 14 (02) : 193 - 201
[5] KITTEL C, 1958, ELEMENTARY STATISTIC, P54
[6] TIMOSHENKO S, 1934, THEORY ELASTICITY, P338