ROOM-TEMPERATURE INTERDIFFUSION STUDY IN A GOLD-LEAD THIN-FILM COUPLE

被引：13
作者：
LLOYD, JR
NAKAHARA, S
机构：
[1] BELL TEL LABS INC,MURRAY HILL,NJ 07974
[2] STEVENS INST TECHNOL,DEPT MAT & MET ENGN,HOBOKEN,NJ 07030
来源：
THIN SOLID FILMS | 1978年 / 54卷 / 02期
关键词：
D O I：
10.1016/0040-6090(78)90200-6
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：207 / 213
页数：7
相关论文
共 16 条
[1]  
ASCOLI A, 1961, J I MET, V89, P218
[2]   GOLD-LEAD SYSTEM - INTERSTITIAL DISSOLUTION AND COMPOUND FORMATION [J].
BROEK, JJVD ;
STAATS, W .
SCRIPTA METALLURGICA, 1972, 6 (04) :311-&
[3]  
Dorey A. P., 1969, Thin Solid Films, V4, P445, DOI 10.1016/0040-6090(69)90093-5
[4]   STUDY ON VACUUM DEPOSITION OF METALS .1. ON THE FORMATION OF ALLOYS BY SUCCESSIVE DEPOSITION OF CONSTITUENT METAL VAPOURS IN VACUUM [J].
FUJIKI, Y .
JOURNAL OF THE PHYSICAL SOCIETY OF JAPAN, 1959, 14 (07) :913-917
[5]  
GREBENNIK IP, 1975, FIZ MET METALLOVED+, V39, P1198
[6]   TUNNELING STUDIES OF FORMATION OF INTERMETALLIC COMPOUNDS IN GOLD-LEAD FILMS [J].
HEBARD, AF .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1973, 10 (05) :606-610
[7]   COMPOSITION AND SUPERCONDUCTING PROPERTIES OF AU-PB FILMS [J].
LEDER, LB .
CRYOGENICS, 1968, 8 (06) :364-&
[8]   INTERMETALLIC GROWTH AND CONTACT RESISTANCE OF TIN CONTACTS AFTER AGING [J].
LINDBORG, U ;
ASTHNER, B ;
LIND, L ;
REVAY, LB .
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1976, 12 (01) :33-39
[9]   VOID GROWTH IN EARLY STAGES OF AGING AND ELECTROMIGRATION [J].
LLOYD, JR ;
NAKAHARA, S .
JOURNAL OF APPLIED PHYSICS, 1977, 48 (12) :5092-5095
[10]   LOW-TEMPERATURE VOID GROWTH AND RESISTIVITY DECAY IN THIN EVAPORATED GOLD-FILMS [J].
LLOYD, JR ;
NAKAHARA, S .
THIN SOLID FILMS, 1977, 45 (02) :411-420
12