Study on the Compositions of Photosensitive Ag Paste for Patterning Embedded Fine-Line Inductor in LTCC

被引：0

作者：

Lee, Sang Myoung ^{[1
,2
]}

Park, Seong Dae ^{[1
]}

Yoo, Myong Jae ^{[1
]}

Lee, Woo Sung ^{[1
]}

Kang, Nam Kee ^{[1
]}

Nahm, Sahn ^{[2
]}

机构：

[1] Korea Elect Technol Inst, Elect Mat Packaging Res Ctr, Gyeonggi 463816, South Korea

[2] Korea Univ, Dept Mat Sci & Engn, Seoul 136713, South Korea

来源：

JOURNAL OF THE KOREAN CERAMIC SOCIETY | 2007年 / 44卷 / 03期

关键词：

Ag Paste; LTCC; Thick film lithography; Embedded inductor;

D O I：

10.4191/kcers.2007.44.3.157

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Line width under 100 mu m with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However, combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of 30 mu m with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.

引用

页码：157 / 161

页数：5

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