FULLY AUTOMATED INTEGRATED-CIRCUIT WIRE BONDING SYSTEM

被引:0
作者
NARUSE, M
MIYAZAKI, S
YAMADA, T
KAWATA, K
SAKAGAWA, Y
IGARASHI, K
机构
来源
NEC RESEARCH & DEVELOPMENT | 1980年 / 56期
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D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
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页码:163 / 169
页数:7
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