SILICON-CARBIDE JFET RADIATION RESPONSE

被引:71
作者
MCGARRITY, JM
MCLEAN, FB
DELANCEY, WM
PALMOUR, J
CARTER, C
EDMOND, J
OAKLEY, RE
机构
[1] CREE RES INC,DURHAM,NC
[2] BOOZ ALLEN & HAMILTON INC,LINTHICUM HTS,MD
关键词
D O I
10.1109/23.211393
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Total dose and neutron-induced displacement damage effect studies are reported for n-channel, 2-mum channel length, depletion mode junction-field-effect-transistors (JFETs) fabricated on 6H-silicon carbide. Very little effect was observed on device characteristics for total dose ionizing radiation for doses up to 100 Mrads(Si), but the devices were significantly degraded after a neutron fluence of 10(16) n/cm2 A value of 4.5 +/- 0.5 carriers/cm3/neutrons/cm2 was obtained for the carrier removal rate from neutron irradiation. The results offer promise for SiC devices to be used in applications which combine high-temperature and radiation environments, where the use of Si and GaAs technologies is limited.
引用
收藏
页码:1974 / 1981
页数:8
相关论文
共 19 条
[1]   ENERGY-DEPENDENCE OF ELECTRON DAMAGE AND DISPLACEMENT THRESHOLD ENERGY IN 6H SILICON-CARBIDE [J].
BARRY, AL ;
LEHMANN, B ;
FRITSCH, D ;
BRAUNIG, D .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1991, 38 (06) :1111-1115
[2]  
CAMPBELL RB, 1971, SEMICONDUCTORS SEM B, V7
[3]  
CHOYKE WJ, 1989, PHYSICS CHEM CARBIDE, P563
[4]  
CHOYKE WJ, 1976, RAD EFFECTS SEMICOND, P58
[5]   THIN-FILM DEPOSITION AND MICROELECTRONIC AND OPTOELECTRONIC DEVICE FABRICATION AND CHARACTERIZATION IN MONOCRYSTALLINE ALPHA AND BETA SILICON-CARBIDE [J].
DAVIS, RF ;
KELNER, G ;
SHUR, M ;
PALMOUR, JW ;
EDMOND, JA .
PROCEEDINGS OF THE IEEE, 1991, 79 (05) :677-701
[6]  
EDMOND JA, 1991, 1ST P INT HIGH TEMP, P500
[7]   HIGH-FIELD TRANSPORT IN WIDE-BAND-GAP SEMICONDUCTORS [J].
FERRY, DK .
PHYSICAL REVIEW B, 1975, 12 (06) :2361-2369
[8]  
KANG H, 1973, 3RD P INT C SIL CARB, P493
[9]  
MATUS LG, 1991, 1ST T INT HIGH TEMP, P222
[10]  
MESSENGER GC, 1986, EFFECTS RAD ELECTRON, P201