KINETICS OF DEPOSITION OF ALUMINA PARTICLES FROM COPPER-SULFATE PLATING BATHS

被引：139

作者：

CELIS, JP ^{[1
]}

ROOS, JR ^{[1
]}

机构：

[1] CATHOLIC UNIV LEUVEN,DEPT METAALKUNDE,B-3030 HEVERLE,BELGIUM

来源：

关键词：

D O I：

10.1149/1.2133102

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：1508 / 1511

页数：4

共 11 条

[1]

CELIS JP, TO BE PUBLISHED

[2]

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[3] CODEPOSITION OF ALUMINA AND TITANIA WITH COPPER [J].

CHEN, ES ;

LAKSHMINARAYANAN, GR ;

SAUTTER, FK .

METALLURGICAL TRANSACTIONS, 1971, 2 (04) :937-+

GUGLIELMI, N .

[5]

Kariapper A.M.J., 1974, T I MET FINISH, V52, P87, DOI DOI 10.1080/00202967.1974.11870311

[6]

Kedward E.C., 1974, TRIBOL INT, V7, P221, DOI 10.1016/0041-2678(74)90120-1

[7]

NECKARSULM NSU, 1970, Patent No. 1200410

[8] ELECTRODEPOSITION OF DISPERSION-HARDENED NICKEL-AL2O3 ALLOYS [J].

SAUTTER, FK .

[9]

Snaith D.W., 1972, T IMF, V50, P95, DOI [10.1080/00202967.1972.11870227, DOI 10.1080/00202967.1972.11870227]

[10]

Tomasaewski T.W., 1969, PLATING, V56, P1234