Effects of Debinding Atmosphere on Properties of Sintered Reaction-bonded Si3N4 Prepared by Tape Casting Method

被引：9

作者：

Park, Ji-Sook ^{[1
,2
]}

Lee, Sung-Min ^{[1
]}

Han, Yoon-Soo ^{[1
]}

Hwang, Hae-Jin ^{[2
]}

Ryu, Sung-Soo ^{[1
]}

机构：

[1] Korea Inst Ceram Engn & Technol, Engn Ceram Ctr, Icheon 17303, South Korea

[2] Inha Univ, Dept Mat Sci & Engn, Incheon 22212, South Korea

来源：

JOURNAL OF THE KOREAN CERAMIC SOCIETY | 2016年 / 53卷 / 06期

关键词：

Sintered reaction-bonded silicon nitride; Tape casting; Thermal property; Debinding;

D O I：

10.4191/kcers.2016.53.6.622

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The effects of the debinding atmosphere on the properties of sintered reaction-bonded Si3N4 (SRBSN) ceramics prepared by tape casting method were investigated. Si green tape was produced from Si slurry of Si powder, using 11.5 wt% polyvinyl butyral as the organic binder and 35 wt% dioctyl phthalate as the plasticizer. The debinding process was conducted in air and N-2 atmospheres at 400 degrees C for 4 h. The nitridation process of the debinded Si specimens was performed at 1450 degrees C, followed by sintering at 1850 degrees C and 20 MPa. The results revealed that the debinding atmosphere had a significant effect on Si3N4 densification and thermal conductivity. Owing to the higher sintered density and larger grain size, the thermal conductivity of Si3N4 specimens debinded in air was higher than that of the samples debinded in N-2. Thus, debinding in air could be suitable for the manufacture of high-performance SRBSN substrates by tape casting.

引用

页码：622 / 627

页数：6

共 33 条

[1] Bae B. C., 2009, J OCEAN ENG TECH NOL, V23, P32
[2] Choi M. J., 2000, J KOREAN CERAM SOC, V37, P505
[3] THE EFFECT OF IMPURITIES ON THE DENSIFICATION OF REACTION-BONDED SILICON-NITRIDE (RBSN)
EVANS, JRG
MOULSON, AJ
[J]. JOURNAL OF MATERIALS SCIENCE, 1983, 18 (12) : 3721 - 3728
[4] Effect of particle size and oxygen content of Si on processing, microstructure and thermal conductivity of sintered reaction bonded Si3N4
Golla, Brahma Raju
Ko, Jae Woong
Kim, Jin-Myung
Kim, Hai-Doo
[J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2014, 595 : 60 - 66
[5] HIGH-TEMPERATURE OXIDATION, REDUCTION, AND VOLATILIZATION REACTIONS OF SILICON AND SILICON-CARBIDE
GULBRANSEN, EA
JANSSON, SA
[J]. OXIDATION OF METALS, 1972, 4 (03): : 181 - +
[6] High Thermal Conductivity Silicon Nitride Ceramics
Hirao, Kiyoshi
Zhou, You
Hyuga, Hideki
Ohji, Tatsuki
Kusano, Dai
[J]. JOURNAL OF THE KOREAN CERAMIC SOCIETY, 2012, 49 (04) : 380 - 384
[7] Thermal conductivity of β-Si3N4:: I, effects of various microstructural factors
Kitayama, M
Hirao, K
Toriyama, M
Kanzaki, S
[J]. JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1999, 82 (11) : 3105 - 3112
[8] Thermal Shock and Hot Corrosion Resistance of Si3N4 Fabricated by Nitrided Pressureless Sintering
Kwak, Kil Ho
Kim, Chul
Han, In Sub
Lee, Kee Sung
[J]. JOURNAL OF THE KOREAN CERAMIC SOCIETY, 2009, 46 (05) : 478 - 483
[9] Lee B. T., 1999, KOREAN J MAT RES, V9, P1170
[10] Microstructural characterization of electroconductive Si3N4-TiN composites
Lee, BT
Yoon, YJ
Lee, KH
[J]. MATERIALS LETTERS, 2001, 47 (1-2) : 71 - 76

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