ON-CHIP DECOUPLING ZONE FOR PACKAGE-STRESS REDUCTION

被引：44

作者：

SPIERING, VL ^{[1
]}

BOUWSTRA, S ^{[1
]}

SPIERING, RMEJ ^{[1
]}

机构：

[1] UNIV TWENTE,FAC MECH ENGN,7500 AE ENSCHEDE,NETHERLANDS

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 1993年 / 39卷 / 02期

关键词：

D O I：

10.1016/0924-4247(93)80212-Y

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A mathematical analysis is presented of the reduction of package stresses by introducing an on-chip decoupling zone. Different configurations of the zones are compared, using the finite-element method (FEM) and analytical models. A reduction of several orders of magnitude is obtained when a deep and thin axisymmetrical corrugation with a V-shaped cross section (a V-zone) is applied as the decoupling zone. Approximate expressions for the stiffness and the force reduction are derived. The application of a membrane pressure sensor with a V-zone as decoupling zone is evaluated. It is shown that the sensitivity of the sensor is not reduced by the addition of the V-zone.

引用

页码：149 / 156

页数：8