SURFACE TREATMENTS AND BONDABILITY OF COPPER THICK-FILM CIRCUITS

被引：0

作者：

LIU, TS

PITKANEN, DE

MCIVER, CH

机构：

[1] HONEYWELL INC,DIV LARGE INFORMAT SYST,PHOENIX,AZ

[2] HONEYWELL INC,CTR CORP TECHNOL,MINNEAPOLIS,MN 55413

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1981年 / 4卷 / 04期

关键词：

D O I：

10.1109/TCHMT.1981.1135842

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：417 / 424

页数：8

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