A HIGH-PERFORMANCE THERMAL MODULE FOR COMPUTER PACKAGING

被引：25
作者：
NAYAK, D
HWANG, LT
TURLIK, I
REISMAN, A
机构：
[1] BELL NO RES,RES TRIANGLE PK,NC 27709
[2] N CAROLINA STATE UNIV,DEPT ELECT & COMP ENGN,RALEIGH,NC 27650
来源：
JOURNAL OF ELECTRONIC MATERIALS | 1987年 / 16卷 / 05期
关键词：
D O I：
10.1007/BF02657911
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
26
引用
收藏
页码：357 / 364
页数：8
相关论文
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