THE OVERALL THERMAL-CONDUCTIVITY IN A STRAINING BODY WITH MICROCRACK EVOLUTION

被引:5
作者
TZOU, DY
LI, J
机构
[1] Univ of New Mexico, Albuquerque, United States
关键词
D O I
10.1016/0017-9310(93)90139-W
中图分类号
O414.1 [热力学];
学科分类号
摘要
The overall thermal conductivity in a cracked solid with microcracks evolving in the strain history is studied in this work. The strain field aggravated by the increase of microcrack density and its effect on the overall degradation of thermal conductivity is illustrated. Special emphases are placed on the deformation-induced inhomogeneity and the path-dependency resulting from the evolution of microcracks. The micro-mechanical model established by Budiansky and O'Connell for the degradation of elastic moduli and that established by Tzou for the degradation of overall thermal conductivity are bridged together to describe this complicated phenomenon.
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页码:3887 / 3895
页数:9
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