SIMULATION OF THE ROLE OF CONVECTION IN ELECTRODEPOSITION INTO MICROSCOPIC TRENCHES

The effect on mass transport of Couette and Poiseuille flows passing by a microscopic angular notch is calculated using the finite element method. Recirculation regions are characterized as a function of Reynolds number, notch angle, and depth. The increase in transport rates caused by convective eddies is assessed relative to the pure diffusion case, for boundary layer thicknesses equal to or one ninth as large as the notch depth. Secondary flows are shown to noticeably enhance transport into microscopic trenches at high Peclet numbers, i.e., at very high flow velocities.