THE COPPER SILICON INTERFACE - COMPOSITION AND INTERDIFFUSION

被引：53

作者：

CORN, SH ^{[1
]}

FALCONER, JL ^{[1
]}

CZANDERNA, AW ^{[1
]}

机构：

[1] SOLAR ENERGY RES INST,MAT RES BRANCH,GOLDEN,CO 80401

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1988年 / 6卷 / 03期

关键词：

D O I：

10.1116/1.575620

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：1012 / 1016

页数：5

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