FRACTURE-TOUGHNESS OF SILICON

被引：0
|
作者：
CHEN, CP
LEIPOLD, MH
机构：
来源：
AMERICAN CERAMIC SOCIETY BULLETIN | 1980年 / 59卷 / 04期
关键词：
D O I：
暂无
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
The purpose of the present study was to determine the fracture toughness and to characterize fracture modes of silicon as a function of the orientation of single-crystal and polycrystalline material. Silicon is used in manufacture of solar cells and other photovoltaic sensors.
引用
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页码：469 / 472
页数：4
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